Packaged Substrate Application Series (Tray Disc Function)
Specially designed for Tray disk applications and can be connected to AGVs for unloading.
▪Can be equipped with flip-board function, no need for personnel offline flip-board, to avoid the board surface rubbing, improve the yield rate, save manpower.
PCBID reader for traceability and verification of process parameters.
▪Divider paper, anti-static and de-static function can be available.
▪ Adopt special thin plate suction nozzle to prevent traces, wrinkles and bumps on the surface of the plate.
Applicable plate thickness: 0.05mm~3.2mm
▪ Applicable board size: 620 x 560mm (605)
