Packaged Substrate Series - Direct Imaging System LI-Ledia 7
- Ledia 7 Ledia Highest exposure quality in the series
Thanks to the latest optics, the spot diameter is smaller and the resolution is higher compared to the conventional Ledia6F.
In the Ledia series, the minimum line width of 10 um can be exposed even finer. With just one Ledia 7F, you can
With both circuit and SR graphics exposure, it is a highly versatile device.
- Realization of high quality exposure without selecting the type of solder resist ink
By overlaying the light wavelengths and freely controlling the 3 wavelengths of the light source, it is possible to utilize optimal
The output power exposes a variety of solder resist inks.
Examples of solder resist ink cross-section variations due to different output rates
- Design Matching
- Slim, clear line widths become a reality
Because of the small spot spacing, it is possible to expose the thin, clear line widths required for high multilayer boards.
Whether for future-oriented technology development or as a mass-production machine, this machine is the
A device that will be with you for a long time.
- High resolution image quality
Ledia 7 has an ultra-high resolution. More fine detail on package substrates, carrier-like substrates, etc.
It provides extremely high graphic quality in higher value-added areas.
♦ Varies depending on the characteristics of the photographic material used and the process conditions.
