preheater
Use/Function.
This machine is used for high-end carrier boards embedded in wafers, and it is used to heat the substrate stably and non-contactly before the substrate enters the laminator.
The substrate is pre-heated before attaching the photosensitive light film, thus effectively improving the adhesion of the photoresist.
Principle of operation.
Substrate before the film, by increasing the surface temperature, can effectively improve the adhesion of dry film on the carrier plate, so the use of this equipment on the substrate
Surfaces are pre-heated uniformly and a class 100 cleanliness environment is maintained within the facility.
After the substrate is passed into this equipment from the upstream equipment, the air passing through the high-efficiency filter will be heated by the hot air in the equipment and controlled by the temperature control device.
Uniform hot air circulation is transferred to the surface of the substrate, so that the temperature of the substrate is uniformly conveyed to the laminating machine, to realize the enhancement of the product's microfabricated line products.
Quality and yield requirements.
