Non-contact cleaning machines

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Non-contact cleaning machines

Adoption of multi-stage special design nozzle (Japan Patent:4948787)

Removal of fine dust from substrate surfaces by sharp air streams

Removes fine dust more effectively than commonly designed cleaning machines.

  • Extremely thin substrates

For ultra thin substrate

  • High Performance Air Nozzles

High performance Air nozzle ( V-SPEC )

  • Ultimate Dry Cleaner

Ultimate Dry Cleaner meeting the of the ad-vanced technologies

Non-contact cleaning machines forPCB, FPD, and

Various processes such as electronic parts.

More than 2000 sales worldwide Terrace.

  • Nozzles based on hydrodynamic design

Highly efficient dust removal performance

  • Non-contact cleaning

Removes fine dust from holes and surfaces with height differences.

No damage to the workpiece and no static electricity compared to contact rollers.

  • Highly efficient cleaning counterparts

Helps reduce Tact Time and increase productivity

Substrate transfer speed: 700mm/sec (40m/min) Corresponding to

  • Precise blowing control

The heating line and the cold water control device can be added, and various heating processes can be carried out.

V-SPEC Characteristics of the (extremely thin substrate counterparts)

Features of V - SPEC (Forultra thin substrate )

  • Newly developed non-relative V-linear nozzle for very thin substrates.(Patent pending)
  • Up and down the opposite direction of the configuration of the V-type Slit, so that the upper and lower flow between the mutual

Reduced interference, stabilized substrate transport and removal of fine dust

  • Solve the long-standing problem of rolling extremely thin plates.
  • The in-hole dust, hitherto considered difficult to remove, is removed by the upper and lower opposing

Direction blowing 2 times, can effectively remove fine dust

  • Extremely thin substrates

    Plate thickness t = 0.04mm ~ cleanable

  • V fontSlit tectonic (geology)Non-relative configuration

    Reduction of mutual interference caused by countercurrent, effective reduction of substrate

    Chattering and noise reduction, removing fine dust from the edges of the hole edges.

  • Multi-stage special design nozzle (Japanese patent):4948787 )

  • Dense rollers for stable transport of very thin substrates

  • Optionally, you can choose a de-static device

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